Tijek procesa aluminijske podloge

1. Otvaranje

Proces proizvodnje aluminijske podloge

1. Proces rezanja materijala - rezanje

2. Svrha otvaranja

Izrežite dolazne materijale velikih{0}}veličina na veličinu potrebnu za proizvodnju

3. Mjere opreza za materijale za otvaranje

① Check the size of the first piece after cutting

② Pay attention to the scratches on the aluminum surface and the scratches on the copper surface

③ Pay attention to the layering and draping of the edge of the board

2. Bušenje

1. Proces bušenja

Inspekcijska ploča za učvršćivanje tipli - Bušenje -

2. Svrha bušenja

Pozicioniranje i bušenje ploče za pomoć u daljnjem proizvodnom procesu i montaži kupca

3. Mjere opreza za bušenje

① Check the number of drilled holes and the size of the holes

② Avoid scratches on the sheet

③ Check the drape of the aluminum surface and the deviation of the hole position

④ Check and replace the drill bit in time

⑤ Drilling is divided into two stages, one drilling: after cutting the material, the drilling is a peripheral tool hole

Drugo bušenje: rupa za alat u jedinici nakon maske za lemljenje

3. Snimanje suhog/mokrog filma

1. Proces snimanja suhog/mokrog filma

Brusna ploča - film - ekspozicija - razvoj

2. Svrha snimanja suhog/mokrog filma

Dijelovi potrebni za izradu kruga prikazani su na listu

3. Mjere opreza za snimanje suhog/mokrog filma

① Check whether there is an open circuit in the circuit after developing

② Whether there is any deviation in the development alignment to prevent the occurrence of dry film breakage

③ Pay attention to the defective circuit caused by scratches on the board surface

④ There should be no air residue during exposure to prevent poor exposure

⑤ After exposure, keep it still for more than 15 minutes before developing

4. Kiselinsko/alkalno jetkanje

1. Proces kiselinsko/alkalnog jetkanja

Jetkanje - skidanje - sušenje - ploča za pregled

2. Svrha kiselog/alkalnog jetkanja

Nakon snimanja suhog/mokrog filma, zadržite potrebni dio kruga, uklonite višak izvan kruga i obratite pozornost na koroziju aluminijske podloge otopinom za jetkanje tijekom kiselog jetkanja;

3. Mjere opreza za kiselo/alkalno jetkanje

① Note that the etching is not clean and the etching is excessive

② Pay attention to line width and line thickness

③ The copper surface is not allowed to be oxidized or scratched

④ The dry film should be removed cleanly

Pet, svilena maska ​​za lemljenje, likovi

1. Silk screen maska ​​za lemljenje, proces karaktera

Silkscreen - Prije-pečenje - Ekspozicija - Razvoj - Likovi

2. Svrha svilene maske za lemljenje i likova

① Anti-soldering: protect the circuit that does not need to be soldered and prevent the tin from entering and causing a short circuit

② Characters: play the role of marking

3. Stvari koje zahtijevaju pažnju za masku i likove za sito lemljenje

① To check whether there is garbage or foreign matter on the board

COB aluminijska podloga

COB aluminijska podloga

② Check the cleanliness of the stencil ③ Pre-bake for more than 30 minutes after screen printing to avoid bubbles in the lines

④ Pay attention to the thickness and uniformity of the silk screen

⑤ After pre-baking, the board should be completely cooled to avoid sticking to the film or destroying the gloss of the ink surface.

⑥ Place the ink face down during development

6. V-CUT, gong daska

1. V-REZ, postupak gong daske

V-CUT——Gong board——Tear off protective film——Remove Pifeng

2, V-CUT, svrha daske za gong

① V-CUT: Connect a single PCS line to the whole PNL plate cutting and leave a small part for easy packaging and removal.

② gong board: remove the excess part of the circuit board

3. Mjere opreza za V-CUT i gong dasku

① During the V-CUT process, pay attention to the size of V, incomplete edges and burrs

② Pay attention to burrs when the gong board is used, and the gong knife is skewed. Check and replace the gong knife in time.

③ Finally, avoid scratches on the board when removing the front.

Sedam, test, OSP

1. Test, OSP proces

Ispitivanje linije - Ispitivanje otpornosti na napon - OSP

2. Testiranje, svrha OSP-a

① Line test: check whether the completed line is working normally

② Withstand voltage test: check whether the completed line can withstand the specified voltage environment

③ OSP: Make the circuit better for soldering

3, testiranje, OSP mjere opreza

① How to distinguish between qualified and unqualified products after testing

② Placement after finishing OSP

③ Avoid line damage

Osam, FQC, FQA, pakiranje, dostava

1. Proces

FQC - FQA - Pakiranje - Pošiljka

2. Svrha

① FQC conducts full inspection and confirmation of the product

② FQA random inspection and verification

③ Pack and ship to customers as required

3. Obratite pažnju

① FQC pays attention to the confirmation of appearance during the visual inspection process and makes a reasonable distinction

② FQA really conducts random inspections to verify the inspection standards of FQC

③ To confirm the number of packages, avoid mixed boards, wrong boards and package damage 3